Precision Multiwire Cutting for Ultra-Thin, Hard Materials

1. Dual-Axis Motion: Lifting and Swinging Integration

This advanced multiwire saw features a fully integrated lifting and swinging cutting mechanism, providing optimal control of wire trajectory and contact pressure. The dual-axis motion enhances cutting stability while improving material removal rates, especially for hard and brittle materials like sapphire, silicon, quartz, ceramics, and compound semiconductors.

2. Split-Cast Roller Frame for Modular Rigidity and Easy Installation

The split-cast frame design ensures excellent structural stability during high-precision slicing, while also offering benefits in transportation and installation. Its modular construction lowers logistics complexity and reduces total installation time and cost.

3. Super Thin Multiwire Configuration for High Output

Utilizing a dual-row super thin wire layout, the system ensures even tension distribution across multiple diamond wires. This configuration significantly increases cutting efficiency, wire life, and material yield, making it ideal for high-throughput production of ultra-thin wafers.

4. Servo Linear Motor-Based Tension Control System

Equipped with high-dynamic-response linear motors, the system delivers real-time tension adjustment to maintain stable wire conditions during slicing. This level of control enhances cutting precision, reduces wire breakage, and ensures superior dimensional accuracy.

5. Compact, Space-Saving Design

With a compact machine footprint, the system minimizes foundation construction costs and optimizes layout flexibility. It's particularly suited for cleanrooms, fab lines, or multi-machine workshops with space constraints.

6. Designed for Ultra-Thin Hard Material Processing

Tailored for super thin wire slicing of challenging materials, this machine supports high-speed, low-kerf-loss cutting with excellent surface quality. Ideal for applications in the semiconductor, photovoltaic, LED, and precision optics industries.